Descriptions:
Wafer Ring Frame can handle wafers up to150mm,200mm,300mm, and also cusomizable to suit user's requirements.
Material of SUS301,420J1,J2 for alternation.
Wafer Ring Frame standard spec for DISCO is available, and customized specification satisfied.
Multiple wafer ring frame sizes for transporting 6", 8", 12" wafers.
Features:
Stainless Steel
Conductive
Durable
Impact Resistance
Temperature Resistance
Chemical Resistance (Optional)
Ability to handle 150mm, 200mm, and 300mm wafers.
Compatible with frames handling equipment (Disco, TSK, ADT, etc)
Flatness: ≤0.2mm
Hardness:50-55HRC
Surface Finish
Mirror-like Quality or matt finished
Thickness: 1.2mm/1.5mm
Customizable (in term of thickness, size, etc)
Product Application
In-line Wafer Handling
Wafer Dicing
Wafer Back grinding
Wafer Sorting
Wafer/Die Sort, Pick & Place
Wafer/Die Shipping
Wafer Ring Frame order information
Code | Size | Packing |
SSPF-WSP-FR-SUS-SM-6 | 6" | 50pcs/ctn |
SSPF-WSP-FR-SUS-SM-8 | 8" | 50pcs/ctn |
SSPF-WSP-FR-SUS-SM-12 | 12" | 50pcs/ctn |
SSPF-WSP-FR-SUS-MS-6 | 6" | 50pcs/ctn |
SSPF-WSP-FR-SUS-MS-8 | 8" | 50pcs/ctn |
SSPF-WSP-FR-SUS-MS-12 | 12" | 50pcs/ctn |
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