Interleaf Wafer Separator

Description:

Interleaf Wafer Separator are construction with 100% conductive PE material

Interleaf Wafer Separator compounding technology gives the spacer the performance of ESD protection, low particles, and low ion contamination. Embossing prevents adhesion to the wafer. Both sides can be used.
Pick-up with a vacuum pad is also possible.

Features

Static antistatic performance

Low particle level

Low ion contamination

Interleaf Wafer Separator have the same surface pattern

Specification

Material：Conductive PE

Surface resistance value：R < 10×10^4~6Ω

Emboss Thickness:10~15μｍ

Smooth Thickness: 10~15μｍ

Interleaf Wafer Separator order information:

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