Tyvek Circle Wafer Interleaf Paper

Tyvek Circle Wafer Interleaf Paper
Details:
Tyvek Circle Wafer Interleaf Paper are construction with DUPONT Tyvek D-type series material and minimize ESD,it use to Interleaf for use between individual wafers,class 100
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Description
Technical Parameters


Descriptions:

Tyvek Circle Wafer Interleaf Paper are construction with DUPONT Tyvek D-type series materials and minimize ESD,

it use to Interleaf for use between individual wafer.

DuPont Tyvek is made of high-density polyethylene filament through a special process, all for the clean aspects of raw materials have been to the static and anti-static coating treatment, which itself only need to be purified then can be applied to Clean grade higher environments, and the material itself in the purification will not cause secondary pollution

DuPont Tyvek is the only wafer packaging material that does not increase reading errors. 

Tyvek Tyvek’s (D-type) unique features make it becomes a good packing material in anti-static, integrated circuits, the electronics industry, silicon manufacturing, solar cells and other products

The features includes:Unique surface smoothness, no friction, anti-static, waterproof, PH neutral, chemically inert, no lint, durables.

Tyvek wafer separators 2


Tyvek Circle Wafer Interleaf Paper of Features:

Tear resistance to help secure the protection between wafer

Low linting and smooth surfaces can help avoid particles and scratching

Anti-static treatment can help minimize ESD (Electrostatic Discharge)


Tyvek Circle Wafer Interleaf Paper of Performance:

NameTyvek Circle Wafer Interleaf Paper for protecting semiconductor
UsagePackaging,to protect wafer and semiconductor.
Material1025D ,1056D tyvek paper
Size6,8,12 inch(diameter)
Surface resistance07-1010 ohms / square
Thickness130~165um
ShapeCircle

Application:

Tyvek Circle Wafer Interleaf Paper are use to Interleaf for use between individual wafer

Cleanliness level:Class 100~1000



Wafer

Chip

IC

TFT-LCD

Solar wafer

Solar Silicon Wafer

Solar Cell Wafer

Multi-monocrystalline Silicon wafer

Semiconductors

Microelectronics

      PCB


Tyvek wafer separators 3

Orders information:

Tyvek Circle Wafer Interleaf Paper

Wafer size

Order code

Interleaf Diameters

Separator Thickness

Packag

4"

SSeIL0010-eM-03-A-WHT

100mm

0.16 mm (.006")

250/pack

5"

SSeIL0007-eM-03-A-WHT

125mm

0.16 mm (.006")

250/pack

6"

SSeIL0005-eM-03-A-WHT

150mm

0.16 mm (.006")

250/pack

8"

SSeIL0004-eM-03-A-WHT

200mm

0.16 mm (.006")

250/pack

12"

SSeIL0006-eM-03-A-WHT

300mm

0.16 mm (.006")

250/pack


Tyvek Circle Wafer Interleaf Paper of FAQ: 

1.Q:Do you provide free samples?
   A:Yes. We provide free samples, with freight collection.

2.Q: What is the lead time for delivery?
   A: Usually 7-10 days after payment (deposit).This time includes production time, and testing time before leaving  factory.

3.Q: What is your MOQ?
   A:Normally,our MOQ is 1000m2,but it is also based on the customer's demand.

4.Q: Are you factory? Can we visit your factory?
   A:Yes, we are a professional manufacture of cleanroom consumable.
       Welcome to visit our factory.

5.Q:If any questions about after sale, what can you do solutions for us ?
  A:Please kindly take the clear photos or videos to describe the questions, we will check them firstly, then offer the solutions in 24-48 hours.














 

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Tyvek Circle Wafer Interleaf Paper of performances:

NameTyvek interleaf wafer spacer for protecting semiconductor
UsagePackaging,to protect wafer and semiconductor.
Material1025D ,1056D tyvek paper
Size6,8,12 inch(diameter)
Surface resistance07-1010 ohms / square
Thickness130~165um
Shape

Circle



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