Smartet Technology Development Co., Ltd. is one of the most reliable manufacturers and suppliers of wafer foup in China, also supports customized service. If you're going to wholesale high quality wafer foup made in China, welcome to get quotation and free sample from our factory. For price consultation, contact us.
Product Decription
SEMI/FIMS compliant
Automated operation minimizes potential contamination from human interaction
Automation opening and closing
Ultrapure, low outgassing materials protect wafers
Robust wafer retention ensures reduced particle generation
The Front-Opening Unified Pod (eFOUP) is a specialized, critical container used in semiconductor manufacturing to transport and store silicon wafers, particularly those of the 300 mm variety.
This innovation has revolutionized the semiconductor industry, addressing the complex demands of handling highly sensitive and valuable wafer substrates.
The eFOUP for 300 mm wafers is meticulously designed to ensure the utmost protection against contaminants, physical damage, and electrostatic discharge, all of which can significantly impact the quality and yield of semiconductor devices.
The 300 mm eFOUP can hold up to 25 wafers at a time, providing a standardized and efficient method for batch processing, which is vital for the high-volume production environment of modern semiconductor fabs.
One of the key features of the FOUP is its front-opening design, which integrates seamlessly with automated material handling systems (AMHS) and process equipment.
This design allows for precise and contamination-free wafer transfers, as the wafers are accessed from the front of the pod using robotic arms.
This automation minimizes human intervention, thereby reducing the risk of contamination and mechanical damage.
Order information
| Code | Size | Packing |
|
SSPF-WSP-FOUP-300A |
12" 300mm | 1pcs/bag |
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