Product Description
Metal Wafer Cassette is a precision-engineered, all-aluminum cassette designed for processing semiconductor wafer in high-temperature environments, up to 350°C. Built to meet SEMI standards, this metal cassette offer enhanced durability and thermal performance, ideal for processes like chemical vapor deposition (CVD), rapid thermal process (RTP), and wafer annealing.
With outside dimension matching industry standard plastic cassette, the metal wafer cassette integrate seamlessly into existing stage and transfer automation system. It is available in 25-slots for automated applications. The metal wafer cassette's all-aluminum construction, with hard clear (HC) anodized surface, ensures long-lasting abrasion resistance, making it suitable for ISO 3 (FS209E Class 1) cleanroom environments.
Metal wafer cassette are offered with short lead times and at an economical price. For custom application, the cassette can be ordered with electroless nickel plating (EN) for vacuum environment, double H-bar for flipping and inverting operation, alternative slot profile for thicker substrate, and option for with or without end-wall handle. A small minimum order quantity is required for custom configuration.
The metal wafer cassette excel in high-temperature environment where plastic cassette fail, making it ideal for bake processes, precision handling of thin and thick wafers, and high wafer insertion temperature.
Manufactured in an ISO9001 certified facility, the metal wafer cassette meets global standards for quality and reliability, offering a high-performance solution for wafer handling in semiconductor process environment.
Feature:
Handles high-temperature processing up to 350°C
Hard anodized aluminum for durability in ISO 3 cleanrooms
Custom options: nickel plating, double H-bar, and slot profiles
Short lead times, economical pricing, and low MOQ for custom orders
Order information
| Code | Size | Packing |
|
SSPF-WSP-WFCST-MAL-8-25 |
8" | 2 pcs/case |
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